Application Background
The 3-pin packaged single-mode 980nm pump module features miniaturization, low power consumption, and a wide operating temperature range, which is suitable for applications requiring miniaturization and compactness, including next-generation miniaturized EDFA modules and systems, pluggable optical amplifier modules, and optical amplifier modules for data centers, etc. It can be widely used in optical communication and optical sensing fields in the future.
Product Features
1,High performance and reliability: The module output power reaches 300mW, which meets the reliability verification standard for optical communication;
2. Miniaturization: the use of small-sized 3-pin form of packaging modules, the module shell volume compared with 14-pin module reduced by 93%;
3. Low power consumption: the use of non-cooled package, in addition to the high power consumption of the TEC, to achieve a very low operating power consumption;
4. Wide operating temperature range: for 0-75 ℃ large temperature range of good lock-wave performance and high temperature long-term stability.
Based on the new generation of communication-grade single-mode 980nm high-power laser chip, a new type of 3-pin package module has been developed. In view of the characteristics and requirements of uncooled applications, through in-depth research on chip design, material growth, device process, and module wave-locking, we have successfully developed single-mode high-power chips and modules, and realized stable wave-locking over a wide range of temperatures without TEC refrigeration.
Single-mode 980nm pump module in 3-pin package
Typical LIV and spectral curves at 25/75°C operating temperature:
Product Series
Center wavelength: 972-976nm
Output power: 300mW@CW
Working temperature: 0-75℃
Module Specification:
