Modern Electronic Welding Technology Development, The Advantages Of The Application Of Laser Soldering Process

The rapid development of modern electronics and information technology, integrated circuit chip packaging forms are also endless, packaging density is getting higher and higher, greatly promoting the development of electronic products to multi-functional, high-performance, high-reliability and low-cost direction. So far, through-hole technology (THT) and surface mount technology (SMT) are very common in the electronic assembly manufacturing industry. They have been widely used in the PCBA process and have their own advantages or technology areas.
As electronic assemblies become more and more dense, some of the through-hole cartridges can no longer be soldered by traditional wave soldering. The emergence of selective laser soldering technology, it seems to meet the through-hole components welding development requirements and the development of a special form of selective brazing technology, its process can be used as a replacement for wave soldering, able to optimize the process parameters of the soldering point by point in order to achieve assorted welding quality.
Through-hole components welding process evolution
In the course of the development of modern electronic welding technology, has experienced two historic changes:
The first is from the through-hole welding technology to the transformation of surface mount welding technology; the second is what we are experiencing from the leaded soldering technology to the transformation of lead-free soldering technology.
Laser Welding of Through-Hole Components
The evolution of soldering technology has had two direct results:
First, the circuit board needs to be welded on the through-hole components less and less; Second, through-hole components (especially large heat capacity or fine-pitch components) is more and more difficult to weld, especially for lead-free and high reliability requirements of the product.
Again, look at the new challenges facing the global electronics assembly industry:
Global competition is forcing manufacturers to bring products to market in shorter time frames to meet changing customer requirements; seasonal changes in product demand require flexible manufacturing concepts; global competition is forcing manufacturers to reduce operating costs while improving quality; and lead-free production has become a major trend. The above challenges are naturally reflected in the choice of production methods and equipment, which is why selective laser soldering in recent years than other welding methods have developed faster than the main reason; of course, the arrival of the lead-free era is also another important factor in promoting its development.
Modern electronic welding technology development, the application of laser soldering process advantages
Laser tin soldering machine is one of the process equipment used in the manufacture of various electronic assemblies, the process involves soldering specific electronic components to a printed circuit board without affecting other areas of the board, usually involving the circuit board. It is generally accomplished through three processes: wetting, diffusion and metallurgy, whereby the solder gradually diffuses into the pad metal on the circuit board, forming an alloy layer on the contact surface of the solder and the pad metal metal to bond the two firmly. Selective soldering is accomplished sequentially for each solder joint through the equipment programming device.
Advantages of laser soldering machine in electronic manufacturing
Modern electronic welding technology development, the advantages of the application of laser soldering process
1. Non-contact processing, no stress, no pollution;
2. High quality and consistency of laser soldering, full solder joints, no tin bead residue;
3. Laser soldering can be easily automated;
4. Low energy consumption of equipment, energy saving and environmental protection, low cost of consumables, low maintenance costs;
5. Compatible with larger pads and precision pads, assortment of pad size up to 60um, easy to realize precision welding;
6. Simple process, a welding is completed, do not need to spray / print flux and subsequent cleaning process.