Tesken Group, a Czech high-performance imaging company, has acquired ultrafast laser technology specialist FemtoInnovations. The transaction also includes the establishment of a new Laser Technology Business Unit (LTBU) at the University of Connecticut Tech Park.
The Brno-based company announced, "The new unit will expand Tesken's portfolio of correlation analysis and multimodal technology solutions for the semiconductor, biomedical device manufacturing, and advanced research markets."
"FemtoInnovations brings to Tesken a unique and disruptive laser platform technology that has been proven in demanding workflows and is generating significant interest from leading companies in the semiconductor, advanced manufacturing, and high-tech industries worldwide."
The new "FLAME" center (short for FemtoInnovations' Laser Advanced Manufacturing and Engineering Center) will be located in the Innovation Partnership Building at the University of Connecticut Tech Park. The center will focus on applied research and development in semiconductor and biomedical device manufacturing, accelerating technology development and workflow optimization.
From a strategic perspective, the decision was based primarily on three factors: the capabilities of the FemtoInnovations team, the maturity of its ultrafast laser platform in real-world workflows, and a clear cultural fit with customer-driven problem solving.
According to FemtoInnovations' website, its laser systems are designed to meet application needs in fields such as micro- and nanofabrication, biomedical device manufacturing, and microelectronics failure analysis.
For example, the company's flagship "Femtosecond Etching System" (FemtoChisel) combines nanofabrication and machine vision technologies and can be equipped with a variety of optional inspection modules, including laser-induced breakdown spectroscopy, confocal microscopy, and scanning electron microscopy.
Sina Shahbazmohamadi, CEO and co-founder of FemtoInnovations, stated in a Tesken press release: "Innovation is a core driving force for our team, and we are committed to developing disruptive laser processing technologies."
He further emphasized: "Combining our ultrafast laser systems with Tesken's leading imaging and analysis platforms will open up a new dimension in integrated workflows. This collaboration will not only accelerate technological breakthroughs but also redefine business possibilities for our customers. We look forward to collaborating on innovation and continuing Tesken's tradition of excellence and innovation."
Tesken stated that the newly established laser business unit will work closely with its existing electron microscopy and microCT units, with the goal of providing integrated workflow solutions starting in 2026.
"By combining ultrafast laser micromachining with our leading imaging and analysis platforms, customers can accelerate the journey from problem discovery to insight in areas such as failure analysis, sample preparation, R&D, and advanced manufacturing," said Jean-Charles Chen, CEO of Tesken.
Bruno Janssens, Chief Strategy Officer of Tesken, added, "We are always looking for partners with deep engineering expertise and unparalleled innovation momentum. FemtoInnovations' disruptive laser processing technology and its ability to create ready-to-use platforms are a strategic fit that will enhance customer value. We are delighted to welcome the team to the Tesken family."
"We are excited about this unique industry-university-research partnership, which will foster talent development, innovation, and the industrialization of advanced laser technologies for semiconductor and biomedical devices," said Dr. Emmanouil Anagnostou, Executive Director of the University of Connecticut Technology Park.
Tesken Group plans to publicly showcase its new product portfolio incorporating ultrafast laser technology for the first time at the International Symposium on Failure Analysis (ISTFA) in Pasadena, California, in November 2025.
