Laser Glass Packaging Field, This Enterprise Significantly Expand Production

Recently, LPKF, a leading provider of innovative laser solutions in Germany, announced that it will significantly increase the production capacity of its laser technology in response to the growing demand for glass packaging materials in the semiconductor industry.
As the semiconductor industry gradually shifts to the use of glass as a material for packaging advanced chips, LPKF is leading the way from incremental production to a new era of high-volume production with its proven Laser Induced Depth Etching (LIDE) technology.
Glass as a substrate material is seen as a key future building block for advanced packaging and heterogeneous integration. It is capable of overcoming the challenges faced by traditional materials such as silicon and glass fiber reinforced plastics in the encapsulation process.LPKF has achieved significant results in research, process and product development in the field of glass encapsulation, and its proven LIDE technology is already capable of meeting the demands of high-volume production.
Klaus Fiedler, CEO of LPKF, says that the company's technology is mature enough to meet the needs of the semiconductor industry.
Over the past 10 years, LPKF has been developing industrial processes for glass manufacturing that meet the requirements of the industry and has successfully validated its Laser Induced Depth Etching (LIDE) process. This process is capable of quickly and accurately processing a wide range of glass substrates from 100μm-1.1mm without damage such as micro-cracks, which is critical for the scalability, reliability and cost-effectiveness of electronic packaging.
LPKF not only integrates this technology into its customers' manufacturing processes, but also provides manufacturing services through its Vitrion division to support customers' adoption of glass substrates for advanced packaging applications. LPKF has now proven the maturity and reliability of its technology by installing dozens of relevant tools worldwide and producing thousands of glass substrates in its own production facilities.
The company has been working with major global manufacturers for many years to make glass available to the semiconductor and display industries, and today LPKF has made significant progress with new technology, with a number of LIDE systems (Laser Induced Depth Etching) already in operation.
With the growing demand for high-performance chips, especially in the field of artificial intelligence, leading chip manufacturers are actively seeking glass substrates as packaging materials," says Klaus Fiedler. This trend is driving further demand for our LIDE technology, as we are able to meet their requirements for high precision, flexibility and design freedom with a high level of process maturity and tangible evidence of performance."
As a leader in laser solutions for the technology industry, LPKF laser systems play a vital role in the production of printed circuit boards, microchips, automotive components, solar modules and many other components. Since its founding in 1976, LPKF has been headquartered in Garbsen, near Hanover, Germany, and operates through subsidiaries and representative offices around the world.