Entering 2026, the driving force for growth in the laser industry has shifted from the equipment side to the application side. Semiconductor manufacturing upgrades, new energy production capacity expansion, and the explosion of AI computing infrastructure are building multiple driving wheels for industrial growth. Lasers have gradually evolved from core power to "light blades" for high-end manufacturing. The jumps in their power, pulse width, wavelength and integration directly affect the terminal manufacturing industry worth trillions. The domestic counterparts of upstream laser crystals, special optical fibers and precision components have become the underlying support for the resilience of the laser industry chain.
In the semiconductor field, silicon carbide wafer cutting and advanced packaging laser drilling have put forward strict requirements for the stability and beam pointing accuracy of ultrafast lasers; in the new energy field, laser welding and pole piece cutting of highly reflective materials such as copper and aluminum have forced fiber lasers to iterate in the direction of green light bands and annular spots; the explosion of AI computing power infrastructure has directly boosted strong demand for narrow linewidth DFB lasers and silicon light integrated light sources. The strong traction of downstream demand has simultaneously led to systematic breakthroughs in key links such as high-power semiconductor laser chips, gallium nitride laser chips, special optical fibers, and nonlinear optical crystals. The localization rate continues to rise, providing a solid foundation for lasers to move from "usable" to "easy to use."
The CIOE Laser Technology and Intelligent Manufacturing Exhibition, held at the Shenzhen International Convention and Exhibition Center from September 9 to 11, 2026, will focus on presenting full-link innovation from display materials, lasers, laser processing and automation equipment to intelligent solutions, helping downstream application fields to explore new applications and new needs in the laser industry.
Lasers: Technology iteration accelerates, engineering capabilities become the core of competition
Han's Laser launched an ultraviolet green nanosecond laser at the beginning of the year, with a localization rate of more than 85%. Recently, it also demonstrated a cutting automation solution empowered by self-developed AI agents, as well as lightweight new products such as blue ring three-spot lasers; Relying on its aerospace science and engineering background, Raycus Laser continues to deepen its efforts in the field of high-power fiber lasers and delivered multiple 8kW-class fiber lasers to Huazhong University of Science and Technology this year; Chuangxin Laser released the world's first 10,000W MOPA pulse fiber laser, the measured pulse laser single fiber output exceeds 10.38kW, and the peak power is up to 1.7MW, filling the gap in the industrial application field of 10,000-watt MOPA. Caplin has launched a new ultrafast laser product covering small/medium/high power picosecond and fiber/solid femtosecond, building an autonomously controllable ultrafast technology matrix in the full power range. Its femtosecond laser uses chirped pulse amplification technology and the pulse width is compressed to less than 300fs.
This exhibition has gathered Han's, Raycus, Chuangxin, Light Conversion, Litilit, Vertilas Gmbh, Keplin, Futoni, Luosi Laser, Zhongjiu Daguang, Huaguang, Yinggu, Zhonghui, Liangyuan, Jingzhong, Guoshun, Shenglei, Elite, Gongda, Yingnuo, Haoliang, Frequency, Xiafan, Jinqiang, Aiou, Chenrui Tengjing, Mil, Spect and other industry representative companies displayed the latest developments in laser technology.
Domestic substitution of laser materials and components is advancing in depth, and key links continue to make breakthroughs
The advancement of the laser industry is inseparable from the underlying driving force of upstream materials and devices. Every evolution of laser materials directly affects the upper limit of laser performance. Since 2026, systematic domestic substitution in the field of laser materials has accelerated, and key breakthroughs have been achieved in silicon photonics integration, gallium nitride laser chips, nonlinear optical crystals and other directions.
Changguang Huaxin recently demonstrated a complete VCSEL chip product matrix based on a fully independent IDM platform, focusing on the launch of high-power and high-brightness 2D addressable VCSEL, fully empowering the large-scale production of lidar in 2026; Ripple Optoelectronics launched a high-efficiency, high-temperature-resistant 638nm semiconductor laser chip and continued to improve its semiconductor laser chip solutions; Guangyue Technology launched a series of customized product solutions around core passive components such as polarization-maintaining beam combiners, high-power isolators and pump combiners.
Products are widely used in ultrafast lasers, optical fiber sensing and industrial laser systems; Ruijing Laser has obtained the patent authorization for "semiconductor laser chips with current modulation" and has established a full set of high-power semiconductor laser chip IDM platforms. The product wavelength can cover the range of 638nm to 1080nm, and is committed to breaking the industry dependence on "devices without cores" for high-power laser chips; Haitai Optoelectronics is localizing laser crystals and nonlinear optical crystals, and will continue to launch high damage threshold KTP/HGTR-KTP in 2026 Nonlinear crystals, high-stability RTP electro-optical switches, and completed the production capacity expansion of medical-grade alexandrite crystals, providing core materials and device support for ultrafast lasers, industrial processing and medical beauty lasers.
Some representative exhibitors: Changguang Huaxin, Gen Semiconductor, Hurricane Core, Ripple, De Rui, Ruijing, Daheng Optoelectronics, Youzhong Micronano, Dingyang Optoelectronics, Hitech Optoelectronics, Dingxinsheng, Xinyuan Huibo, Guangyan, Guangyue, Ruike, Wuyue, Aerodiode, Jiguang Semiconductor, Xingke, Yida Optoelectronics, Crystal Lattice, USHIO, Sivers, etc.
