Ceramic substrate, is a special process sheet in which copper foil is bonded directly to the surface ( single or double-sided) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The resulting ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent soft brazing and high adhesion strength, and can be etched with various graphics like PCBs, with a large current-carrying capacity. Therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology. Used in high-end circuit boards, high hardness, high temperature resistance, thermal stability, but also a good insulator, many excellent characteristics, has been widely used in the military, aerospace, high-end 3C industry.
However, the current ceramic substrate processing molding process, can not be accurately reserved for the latter part of the process to be used in a variety of holes, slots, edges, molding also need to be punched and cut, and hard and brittle characteristics, the processing process is fragile, easy to produce micro-cracking, especially small holes and micro-hole processing, a substrate needs to process thousands of holes, such as hole positioning accuracy is low, will cause subsequent hole filling printing deviation; such as hole roundness and consistency is poor, will Lead to low insert and line accuracy; such as hole wall quality is poor, will affect the subsequent hole metallization process; so the hole punching process is quite important, difficult and challenging. At present, the commonly used hole punching methods, mechanical processing, ultrasonic processing, laser processing.
Although laser processing has many advantages, there are also some difficulties that need to be overcome, such as the thermal effect of the cutting process, the processing surface of the slag and recast layer, all need to process, weighing the various impact factors, taking into account the efficiency and processing quality, debugging the best solution.
Chengdu Mileage Laser, focusing on laser micro processing solutions, deep plowing industry for many years, has an experienced R & D team, in order to solve the industry difficulties of ceramics and other hard and brittle materials, specifically set up the hard and brittle materials processing R & D division, the launch of the linkage ceramic drilling equipment, specifically for DPC ceramic substrate drilling and development, in order to solve the DPC ceramic drilling easy chipping, micro-cracking, low efficiency and other industry pain points, the equipment uses High-precision linear motor and superior laser processing head, with high-performance motion controller to form a four-axis linkage mode, drilling efficiency has been greatly improved, to aluminum nitride ceramic substrate, for example, the thickness of 0.38mm plate processing diameter of 75 microns of round holes, the speed of up to 25 holes / second, in the industry's leading, processing the finished hole size consistent, clean and neat edge, micro-hole taper less than 10 It is the first choice for DPC ceramic substrate mass micro-hole processing, with consistent hole size, clean and neat edge, micro-hole taper less than 10 microns and roundness more than 90%. The product has been continuously iterated and upgraded, and has been widely used in customers' sites, which is widely praised by customers.
In the field of industrial processing, laser is the first tool to be used. In the field of industrial processing, laser as an advanced tool, its advantages in precision processing are very obvious. At present, more and more companies are using laser technology to replace some traditional CNC machine tools, which will bring more benefits to enterprises.
