What is the packaging of an optical module?
In simple terms, the packaging of the optical module refers to the shape of the optical module, with the progress of technology, the optical module is also constantly updated, from the shape of the words are constantly getting smaller, of course, in addition to the shape, the performance of the optical module has also changed a lot, including the rate, transmission distance, output power, sensitivity and operating temperature, etc.
Soldering process for optical module packaging.
In the industry, the traditional encapsulation technology for optical communication devices is generally fixed by bonding the device at the bonding surface with UV adhesive, which is first dabbed onto the device bond and then cured by UV lamp irradiation. This method of joining devices has many drawbacks, for example, limited depth of cure; limited by the geometry of the device; and the adhesive will not cure where the UV lamp does not reach. Both the dispensing device and the UV lamp have to be set up, making the whole system mechanism more complex. Most importantly, when the device is actually used, due to heat and other factors, there will be a slight position shift of the upper and lower devices at the combination, resulting in the device coupling power value out of order, decreasing accuracy and affecting product quality, as well as long production beats and low efficiency.
Laser thermo-soldering is a very mature soldering technology for optical communication modules. By applying solder paste to the pads, the paste is melted by laser heating and then solidified to form a solder joint, which is a relatively simple operation. With its advantages of solid soldering, minimal deformation, high precision, high speed and ease of automatic control, ET Solar's laser thermoelectric soldering makes it one of the most important means of packaging technology for optical communication devices.
Soldering of optical communication FPC soft boards to optical components, PCB hard boards to optical components
Features of the laser thermostatic soldering system
1. High precision laser processing, spot diameter of 0.1mm minimum, can realize micro-pitch mounting devices, Chip parts welding.
2. Short localised heating with minimal thermal impact on the substrate and surrounding components, allowing different heating regimes to be implemented to achieve consistent solder quality depending on the type of component lead.
3. No soldering iron tip consumption, no need to change heaters, high efficiency continuous operation.
4. The laser processing is highly accurate, the laser spot can reach the micron level and the processing time/power program is controlled, the processing accuracy is much higher than the traditional soldering iron. Welding can be carried out in spaces of less than 1mm.
5. Six light paths coaxial, CCD positioning, what you see is what you get, no need to repeatedly correct visual positioning.
6. Non-contact processing, no stresses due to contact welding, no static electricity.
7. Laser as green energy, the cleanest processing method, no consumables, simple maintenance and easy operation.
8. No cracked solder joints when performing lead-free soldering.
