PCB, or printed circuit board, is the mother of all electronic components, and is the most critical component of products in the electronics, communications and IT sectors, playing the role of a bridge between the top and the bottom.
PCBs are becoming smaller and thinner, accommodating more and more electronic components and demanding higher processing precision. The small PCB circuit board has to be equipped with numerous components and the structure is quite complex, which requires more delicate laser processing technology.
PCB laser cutting
The traditional way of processing PCBs, mainly including walking cutters, milling cutters and gongs, has the disadvantages of dust, burrs and stresses, which have a greater impact on PCBs that are small or contain components and cannot meet the demands of new applications. The application of laser technology to PCB cutting provides a new technological direction for PCB processing. Advanced laser processing technology can achieve non-contact cutting a direct shape, with no burr, high precision, high speed, small gap, small heat-affected area and other advantages, compared with the traditional cutting process, laser cutting completely dust-free, stress-free, burr-free, smooth and neat cutting edge, especially the processing of PCB boards soldered with components will not cause damage to the components, has become the best PCB manufacturers It has become the best choice for many PCB manufacturers.
PCB Laser Marking
The rapid pace of electronic product renewal requires a complete data traceability system for PCB products from incoming, production to inspection and outgoing storage. In order to achieve quality control and product traceability in the production process of PCB boards, the product must be marked with text or barcode to give the product a unique ID card. To ensure that the ID card is non-polluting and permanent, while reducing costs, laser marking has become an industry trend instead of label paper.
PCB laser soldering
Laser soldering is a method of brazing in which a laser is used as a heat source to melt the tin to achieve a tight fit on the solder. The advantages of laser soldering technology include the following: it can be used to weld components that are susceptible to thermal damage or cracking in some other welding, without contact and without causing mechanical stress to the welded object; it can be used to irradiate narrow parts of the circuit that are inaccessible to the soldering iron tip and to change the angle when there is no distance between adjacent components in a dense assembly, without heating the entire circuit board; only the welded The soldering area is only partially heated and other non-soldering areas do not bear the thermal effect; the soldering time is short and efficient, and the soldering joint does not form a thick intermetallic layer, so the quality is reliable and highly maintainable.
PCB laser drilling
Conventional mechanical drilling techniques make it difficult to achieve micro-hole processing, with uncontrollable depths in blind holes and the need for frequent tool changes. Laser drilling is a method of forming micro-holes by using an optical structure module consisting of a lens and a lens set to gather light from a laser light source into a high energy density laser beam, which is used to heat, dissolve and ablate the local material. It is particularly suitable for the processing of blind and buried PCB holes. The right drilling method can act as a signal conductor and, by stacking multiple layers, adapt to the needs of processing smaller circuit boards.
