PCB, i.e. Printed Circuit Board, as the mother of electronic components, is the most critical product component in the field of electronics, communications, IT, etc., and bears the role of a bridge between the top and the bottom.
At present, intelligent technology under the 5G, wearable, automatic driving and other industries continue to develop, consumer demand for products to increase, intelligent, thin and light, miniaturization has become the mainstream of the development of PCB volume becomes smaller, the thickness becomes thinner, to accommodate more and more electronic components, the processing precision requirements are also higher and higher. Small PCB circuit boards to install many components, the structure is quite complex, it requires a more delicate laser processing technology.
PCB Laser Cutting
The traditional way of processing PCB, mainly including walking knife, milling cutter, gong knife, etc., there are dust, burr, stress shortcomings, small or PCB circuit boards containing components have a greater impact, can not meet the new application requirements. The application of laser technology in PCB cutting provides a new technical direction for PCB processing. Advanced laser processing technology can realize non-contact cutting a direct molding, with no burrs, high precision, high speed, small gap, small heat-affected area, etc. Compared with the traditional cutting process, laser cutting is completely dust-free, stress-free, burr-free, smooth and neat cutting edges, especially the processing of PCB boards welded with components will not cause damage to the components, and become the best choice for many PCB manufacturers. It has become the best choice for many PCB manufacturers.
PCB laser marking
The rapid replacement of electronic products requires PCB products from warehousing, production to testing, warehousing, the need to establish a complete data traceability system. In order to realize the PCB board production process quality control and product traceability, the product must be marked with text or barcode to give the product a unique ID card. In order to ensure the non-pollution and permanence of the ID card, and at the same time reduce costs, laser marking to replace the label paper has become an industry trend.
PCB Laser Soldering
Laser soldering is a brazing method that uses a laser as a heat source to melt tin so that the soldered parts achieve a close fit. The advantages of laser soldering technology mainly include the following points: can be welded in some other welding is susceptible to thermal damage or easy to crack components, without contact, will not cause mechanical stress to the welding object; can be in the component-intensive circuit of the soldering iron can not enter the narrow parts and in the dense assembly of neighboring components in the absence of distance between the angle of the change of irradiation, without the need to heat the entire circuit board; soldering is only the welding When welding, only the welded area is locally heated, other non-welded areas do not bear the thermal effect; welding time is short, high efficiency, and the welded joints will not form a thick intermetallic material layer, so the quality is reliable and highly maintainable, the traditional soldering iron welding needs to be regularly replaced with a soldering iron tip, while laser welding requires very few replacement parts, so you can cut down on the cost of maintenance.
PCB Laser Drilling
Conventional mechanical drilling technology makes it difficult to realize micro-hole processing, the depth is not controllable in blind hole processing, and the tool has to be changed frequently. Laser drilling refers to the optical structure module composed of lenses and lens sets, the laser light source light gathered into a high energy density laser beam, the use of laser beam heating, dissolution, ablation of local materials, and then processed to form a micro-hole method. It is especially suitable for the processing of PCB blind holes and buried holes. The appropriate drilling method can play the role of signal conduction, and through the multi-layer stacking, to adapt to the smaller volume of circuit board processing needs.
