UV Laser Marking Machine For Keyboard

UV Laser Marking Machine for Keyboard

Product Introduction

UV laser marking machines adopts laser beams to place permanent marks on the surface of various substances. The effect of marking is to reveal the deep material through the evaporation of the surface material, or to "engrave" traces of the surface material through chemical and physical changes caused by light energy, or to burn off part of the material through light energy to reveal the pattern, text, and the content of the product to be marked by the required etching.

UV laser marking machine using 355nm UV laser developed by the machine using the third-order cavity frequency doubling technology compared with infrared laser. 355 UV light focus spot is extremely small, can largely reduce the mechanical deformation of the material and processing heat impact is small, mainly used for ultra-fine marking, engraving, especially suitable for food, pharmaceutical packaging materials marking, punching micro-hole, high-speed division of glass materials and silicon wafer Wafers for complex graphics cutting and other applications.

Application Field

Product Advantage

• UV laser is a cold light source, laser cutting or marking when the thermal impact is particularly small, more suitable for deep processing of materials more sensitive to thermal effects.

• UV laser has a narrower pulse width and higher peak power, for ceramics sapphire and other materials with a higher damage threshold is easy to break through their damage threshold, so it is easy to process polymer materials with high damage threshold requirements.
• the UV laser focused spot can be as small as 15UM, so it is very suitable for micro-hole drilling processing. Laser processing principle: laser marking machine is the use of high energy density laser beam, the workpiece table machine for local irradiation, so that the surface material quickly vaporized or color change, thus revealing the deep material or lead to chemical and physical changes in the surface material engraved traces, or are burned off part of the material through light energy, showing the required etching graphics, text.
• Using the U.S. light wave laser pump, optical resonant cavity for 3 times the frequency output 355nm wavelength laser, electro-optical conversion efficiency of high beam quality for TEM100 mode.
• UV laser is a cold light source, heat-affected zone is small, excellent beam quality to create a super fine marking effect.
• Using imported scanning head, marking speed is fast, while suitable for micro cutting and drilling.
• Ultra-high peak power and very little heat effect characteristics, very suitable for aluminum oxide, zirconia ceramic drilling and cutting, plastic shell does not hurt the surface of the permanent mark, replacing the screen printing effect.
• The laser 20,000 hours maintenance-free, no consumables, low cost of use, power saving and energy saving
• One modular design, easy maintenance, compact size
• Marking environmental protection, in line with ROHS standards
• Software can receive DXF, PLT, BMF, AI, JPG and other formats, and can automatically generate the flow number and production date, bar code, two-dimensional code.

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