Why PCD tools require "non-traditional" machining methods
When tools need to process highly abrasive, difficult-to-machine materials while meeting long-lasting service life and stable geometric accuracy requirements, polycrystalline diamond (PCD) materials are often chosen-typical applications include composite materials, non-ferrous metal alloys, and high-performance wood-based panels. However, the ultra-high hardness and excellent wear resistance of PCD not only bring performance advantages, but also significantly increase the difficulty of processing, making it difficult to complete high-quality forming and regrinding only through traditional grinding processes. In traditional process systems, electrical discharge machining (EDM) or erosion machining, as well as targeted compound grinding processes are usually relied upon to make up for this - but this type of method often comes at the expense of limited processing efficiency, complicated process flow, and insufficient micro-geometry processing capabilities.
As an emerging alternative technology with significant advantages, laser processing is gradually being applied in this industry. Its core advantage is that it can directly generate cutting edges,breaker structures and complex fine geometric features with high process flexibility. This article analyzes the application of galvanometers in laser processing of PCD cutting tools, covering the two key stages of tool manufacturing and regrinding, and guides the key technical requirements of galvanometer systems in practical applications based on typical PCD processing processes. On this basis, these needs are further mapped to two types of SCANLAB scanning galvanometers that are widely used in high-precision micromachining and industrial production:

Application positioning of laser in PCD tool manufacturing and regrinding
When "laser processing" is mentioned in the field of PCD tool manufacturing, it usually refers to the laser ablation process, which removes materials through vaporization or spraying, rather than melting or cutting in the traditional sense. In the actual tool processing process, laser technology is mainly used in two key links:
A) New tool manufacturing
Direct shaping of the cutting edge and rake face and flank geometry on brazed or layered PCD inserts High-precision machining ofbreakers and edge strengthening structures on indexable inserts or rotating tools
Functional microstructure processing to improve cutting performance (such as anti-friction textures, controlled edge areas, etc.)
B) Regrind worn tools
Accurately restore the cutting edge profile while keeping the tool datum plane unchanged
Reconstruct micro-geometric features (including edge arc, chamfer, negative chamfer andbreaker structure)
Enables localized repairs to avoid excessive material removal while optimizing tool economics
Traditional tool processing is mainly based on grinding machine tools, which are widely used in the manufacturing and regrinding of various types of tools (such as milling cutters, drill bits, etc.). In a multi-process parallel tool manufacturing environment, laser processing and traditional grinding usually have a complementary relationship: the grinding process is mainly suitable for the processing of cemented carbide and high-speed steel (HSS) materials, as well as the forming of partial geometric shapes; while laser processing is more suitable for superhard materials and application scenarios that require high micro-geometric flexibility.
Application positioning of laser in PCD tool manufacturing and regrinding
When "laser processing" is mentioned in the field of PCD tool manufacturing, it usually refers to the laser ablation process, which removes materials through vaporization or spraying, rather than melting or cutting in the traditional sense. In the actual tool processing process, laser technology is mainly used in two key links:
A) New tool manufacturing
Direct shaping of the cutting edge and rake face and flank geometry on brazed or layered PCD inserts High-precision machining ofbreakers and edge strengthening structures on indexable inserts or rotating tools
Functional microstructure processing to improve cutting performance (such as anti-friction textures, controlled edge areas, etc.)
B) Regrind worn tools
Accurately restore the cutting edge profile while keeping the tool datum plane unchanged
Reconstruct micro-geometric features (including edge arc, chamfer, negative chamfer andbreaker structure)
Enables localized repairs to avoid excessive material removal while optimizing tool economics
Traditional tool processing is mainly based on grinding machine tools, which are widely used in the manufacturing and regrinding of various types of tools (such as milling cutters, drill bits, etc.). In a multi-process parallel tool manufacturing environment, laser processing and traditional grinding usually have a complementary relationship: the grinding process is mainly suitable for the processing of cemented carbide and high-speed steel (HSS) materials, as well as the forming of partial geometric shapes; while laser processing is more suitable for superhard materials and application scenarios that require high micro-geometric flexibility.
PCD laser processing process window: quality, production efficiency and risk control
PCD processing quality is usually comprehensively evaluated from the following key dimensions:
·Blade integrity (no micro chipping, consistent blade width, controllable blade radius)
·Surface quality of rake face and flank face (directly affects cutting force level and tool wear behavior)
Geometric accuracy (including angular accuracy, runout-related features, and critical geometric position accuracy)
Currently, a significant development trend is ultrashort pulse (USP) lasers-picosecond and femtosecond lasers.
The use of technology continues to grow. Compared with traditional long-pulse processing methods, USP laser can significantly reduce thermal effects and achieve better surface quality and boundary control capabilities in processing high-hardness materials.
During PCD laser processing, the main risk factors include:
·Heat-affected zone (HAZ) and graphitization risk (closely related to the specific process and can be effectively suppressed through pulse strategy, wavelength selection and process parameter optimization)
·The problem of redeposition of debris (whenremoval efficiency or scan path planning is insufficient, it may lead to edge blunting or deterioration of machined surface roughness)
·Pulse placement accuracy error (especially under high repetition frequency conditions, when motion control and laser triggering are not strictly synchronized)
It is at this critical link that the performance of the galvanometer system is no longer just a "performance improvement item", but has directly evolved into a core constraint affecting processing quality and process stability.





